Analyzing A Novel Pin Fin Microchannel Design With Simulation Comsol Blog

Analyzing A Novel Pin Fin Microchannel Design With Simulation Comsol Blog One way to optimize heat transfer within such systems is by adding a pin fin heat sink to the microchannel configuration. applying this approach, a team of researchers created a novel pin fin design, analyzing its heat transfer efficiency with comsol multiphysics. they presented their innovative work at the comsol conference 2015 boston. Blog analyzing a novel pin fin microchannel design with simulation; knowledge base my flux calculation seems wrong; forum issues with importing comsol part from personal library (warning: "created 9 empty objects") knowledge base performing a mesh refinement study.

Analyzing A Novel Pin Fin Microchannel Design With Simulation Comsol Blog Modeling manifold microchannel heat sinks in comsol multiphysics. although mmc heat sinks dissipate heat efficiently, producing them comes with some challenges. for one, the optimal geometric parameters and flow conditions depend on the fan’s blowing power. the width of the microchannels, inlets, outlets, and manifolds may need to be adjusted. The performance analysis is done using the conjugate heat transfer module of comsol multiphysics software. initially, a microchannel with elliptical pin fins of 500 μm fin height in it is validated with the results from the literature. further, the performance of microchannels with three different pin fin layouts is compared with the baseline. The flow velocity increases as it passes through the pin fin region in the x direction, due to the narrower primary microchannel width compared to the straight microchannel region. the flow velocity in the pin fin region is significantly lower in case 2–5 compared to case 1 due to the presence of secondary microchannels, which divert the. Compared with the fixed pin–fin microchannel, the local heat transfer performance of a mchs in the hotspot region is enhanced by 37.9 %, average nu of the microchannel is advanced by 7.4 %, and the maximum chip surface temperature is reduced by up to 3.12 k. moreover, it also shows a significant reduction of 10.7 % in pressure drop.