Mo70cu30 Cu Cpc Molybdenum Copper Alloy Heat Sink Sheet With Nickel Mocu composite material was developed in 1960’s. it has good electrical conductivity, good thermal conductivity, good corrosion resistance, good machinability and adjustable cte. it is widely used as heat sinks in microelectronics packaging, vacuum electrical contactor, aerospace and mining industries. Torrey hills’ heat sinks manufacturing facility specializes in the r&d and production of high tech electronic packaging materials, namely copper tungsten (wcu, cuw), molybdenum copper (mocu, cumo), and copper molybdenum copper (cu mo cu) heat sinks and shims. the facility is top in the field of electronic packaging materials with advanced.
Heat Sink And Spreader Materials In Molybdenum Copper Mocu Tungsten Sizes. molybdenum copper and tungsten copper material is available as finished parts with the following maximum dimensions depending on overall size. width: 4 inches (102 mm) thickness: 3 inches (76 mm) length: 24 inches (610 mm) our thermal management materials can be machined into shapes and readily plated and have superior through thick. Copper molybdenum copper (cmc) heat spreaders. cmc (cu mo cu) laminate is a three layered structure. cmc consists of two outer copper layers and one molybdenum core layer. it is available in varying layer thickness ratios, including 1:1:1, 1:2:1, 1:3:1, and 1:4:1. cmc has a better ct and cte than mo and a higher ct than mocu at the same cte. Compared with w cu materials, molybdenum in mo cu has a relatively low density; thus the use of mo cu can reduce the weight of packaging materials. because of this unique advantage, mocu is a preferred choice in the aerospace, instrumentation, and portable equipment industries. Cu mo cu (cmc) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. it has adjustable cte, high thermal conductivity, and high strength. all types of cu mo cu sheets can be stamped into components. our products are widely used in applications such as optoelectronics packages, microwave packages, c packages.
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